クレジット表記
imageBROKER / サイネットフォト
タイトル
Extreme macro cross-section of a narrow gap between silicon chip and ceramic substrate completely filled with translucent amber cured epoxy underfill, semiconductor packaging photography, AI generated
キーワード
Extreme macro cross-section of a narrow gap between silicon chip and ceramic substrate completely filled with translucent amber cured epoxy underfill, semiconductor packaging photography, AI generated